Focusing on the wire bonding industry
Component test
Based on General Specification for Hybrid Integrated Circuits (GJB2438A-2002), General Specification for Semiconductor Integrated Circuits (GJB597A-1996) and requirements for industrial grade integrated circuits, with reference to Test Methods for Discrete Semiconductor Devices (GJB128-97), Test Methods for Electronic and Electrical Components (GJB360B-2009), and Test Methods and Procedures for Microelectronic Devices (GJB548B-2005), the test, screening, identification and inspection of all items of components are carried out to meet the test requirements of military/civilian users in a fast and high-quality manner, and comprehensive service guarantee is provided.
Service Items
Analysis and detection test
X-ray inspection PIND、 Acoustic scanning, mechanical capping, scanning electron microscopy, section microscopy, internal moisture content analysis
Bond strength test
Sealing, wire firmness, chip shear strength, bonding strength
Mechanical capability test
Constant acceleration, mechanical shock, sweep frequency vibration
Service environment test
Temperature cycle, thermal shock, thermal vacuum, humidity resistance, salt spray
Electrical parameter test
Discrete semiconductor devices, integrated circuits, hybrid integrated circuits, resistance capacitance sensing elements
Build test system
Using NI board and LABVIEW software to quickly build the test system
Contact Info
Tel: 0086-535-6371516
Tel: 0086-535-6379128
E-mail: yesdo@163.com
Add: No. 36, Macao Road, Development Zone, Yantai City, Shandong Province, China
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