Au Silver Bonding Wire
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  • Au Silver Bonding Wire

Product Advantages

◎ No gas protection in the bonding process  

◎ Better Mechanical  Properties than good wire

◎ IMC grow slowly

◎ Good bonding workability

ProductTypeMain content AgPd contentAu contentScope of application
Au Silver Bonding WireYAF≥96.7%≤1.5%1.1-1.3%Vehicle level devices, storage devices, LED packaging, etc
YAFA≥94.5%≤1.5%3.3-3.5%
YAFB≥97.9%/1.1-1.3%
YAFH≥93.8%≤1.5%3.8-4.2%
Au Silver Bonding Wire
+
  • Au Silver Bonding Wire

Au Silver Bonding Wire

◎ No gas protection in the bonding process ◎ Better Mechanical Properties than good wire ◎ IMC grow slowly ◎ Good bonding workability


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