Product Advantages
◎ No gas protection in the bonding process
◎ Better Mechanical Properties than good wire
◎ IMC grow slowly
◎ Good bonding workability
| Product | Type | Main content Ag | Pd content | Au content | Scope of application |
| Au Silver Bonding Wire | YAF | ≥96.7% | ≤1.5% | 1.1-1.3% | Vehicle level devices, storage devices, LED packaging, etc |
| YAFA | ≥94.5% | ≤1.5% | 3.3-3.5% | ||
| YAFB | ≥97.9% | / | 1.1-1.3% | ||
| YAFH | ≥93.8% | ≤1.5% | 3.8-4.2% |
Keywords:
Au Silver Bonding Wire
◎ No gas protection in the bonding process
◎ Better Mechanical Properties than good wire
◎ IMC grow slowly
◎ Good bonding workability
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