Focusing on the wire bonding industry

Product Advantages

◎ Smaller wire diameter

◎ Obvious cost advantage

◎ Suitable for micro-pitch welding

◎ IMC Slow growth, higher reliability

◎ Good electrical and thermal conductivity

Product	Type	Peculiarity	Scope of application
Copper Bonding Wire	YC1	5N, high purity , low hardness, good ball forming performance	LED package,IC package（DIP、SIP、SOP、QFP）, TR（TO、SOP、SOD）
	YC2	4N, flexible bonded copper wire, invention patent, low hardness, high conductivity, good fatigue resistance.
	YC3	3N,small alloy copper wire, good ball formation, strong corrosion resistance, high fatigue resistance
	YC4	2N, large alloy copper wire, high reliability, high second welding strength, good ball formation

Resistance to oxidation

<1000℃: 2Cu+O₂→2CuO

>1000℃: 4CuO→2Cu₂O+O₂

Test condition：0.8mil、RH50%

The biggest difference between copper wire and gold wire and silver wire is easy oxidation, during the welding process due to discharge and substrate heating, copper oxide will be formed, resulting in FAB ball shape is not round, easy to form welding, so it is very important to make copper wire oxidation resistance.

Keywords:

Copper Bonding Wire

◎ Smaller wire diameter ◎ Obvious cost advantage ◎ Suitable for micro-pitch welding ◎ IMC Slow growth, higher reliability ◎ Good electrical and thermal conductivity

E-mail: yesdo@163.com

Tel: +86-0535-6371516

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