Product Advantages
◎ Manufactured from high-purity materials(99.999%)
◎ Unique alloy doping
◎ Excellent wire stability
◎ Excellent bonding workability
| Product | Type | Purity | Peculiarity | Scope of application |
Gold bonding wire | YG1、YG3、 YG5、YG6、YG7 | ≥99.99% | Used for most ordinary sums High speed bonding, small doping,High strength, and arc stability | Medium-High end LED package and High end IC package(LQFP、BGA、QFN、QFP、DIP、SIP、CSP...) |
| YG8 | ≥99% | High doping, high reliability, low loop | High end IC package(QFN、LQFP、BGA、CSP) | |
Gold alloy bonding wire | YGA1 YGA1B YGA2 YGA3 YGA5 | 80Au 74Au 60Au 70Au 50Au | Precious metal addition, Superior gold wire Mechanical strength of, high bonding stability, and obvious cost advantages | LED package(High power、COB、EMC、PPA...)and parts of IC package |
Keywords:
Gold Bonding Wire
◎ Manufactured from high-purity materials(99.999%)
◎ Unique alloy doping
◎ Excellent wire stability
◎ Excellent bonding workability
Contact Us