Gold Bonding Wire
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  • Gold Bonding Wire

Product Advantages

◎ Manufactured from high-purity materials(99.999%)

◎ Unique alloy doping

◎ Excellent wire stability

◎ Excellent bonding workability

ProductTypePurityPeculiarityScope of application

 

Gold bonding wire

YG1、YG3、

YG5、YG6、YG7

≥99.99%Used for most ordinary sums High speed bonding, small doping,High strength, and arc stabilityMedium-High end LED package and High end IC package(LQFP、BGA、QFN、QFP、DIP、SIP、CSP...)
YG8≥99%High doping, high reliability, low loopHigh end IC package(QFN、LQFP、BGA、CSP)

 

Gold alloy bonding wire

YGA1

YGA1B

YGA2

YGA3

YGA5

80Au

74Au

60Au

70Au

50Au

Precious metal addition, Superior gold wire

Mechanical strength of, high bonding stability, and obvious cost advantages

LED package(High power、COB、EMC、PPA...)and parts of IC package
Gold Bonding Wire
+
  • Gold Bonding Wire

Gold Bonding Wire

◎ Manufactured from high-purity materials(99.999%) ◎ Unique alloy doping ◎ Excellent wire stability ◎ Excellent bonding workability


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