Focusing on the wire bonding industry

Product Advantages

◎ Good oxidation resistance

◎ The second solder joint has excellent performance

◎ Pd well-coated，high reliability

◎ The atmosphere protection is not sensitive

◎ Line arc stabilization

◎ The bonding window is extensive

Product	Type	Main content Cu	Pd content	Au content	20um plating thickness	Scope of application
Pd Copper Bonding Wire	YCP	≥97.9%	1.2-2.0%	/	45-85nm	LED package, IC package (QFN, QFP, BGA, CSP, RGB)
	YCPT	≥98.7%	0.9-1.2%	/	35-45nm
	YCPH	≥96.9%	2.0-3.0%	/	85-110nm
Au/Pd Copper Bonding Wire	YCAP	≥97.8%	1.2-2.0%	0.05-0.1%	45-85nm
	YCAPT	≥98.6%	0.9-1.2%	0.05-0.1%	35-45nm
	YCAPH	≥96.8%	2.0-3.0%	0.05-0.1%	85-110nm

Keywords:

Au/Pd Copper Bonding Wire

◎ Good oxidation resistance ◎ The second solder joint has excellent performance ◎ Pd well-coated，high reliability ◎ The atmosphere protection is not sensitive ◎ Line arc stabilization ◎ The bonding window is extensive

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