Gold Bonding Wire

◎ Manufactured from high-purity materials(99.999%) ◎ Unique alloy doping ◎ Excellent wire stability ◎ Excellent bonding workability

Silver Bonding Wire

◎ Manufactured from high-purity materials ◎ Unique alloy doping ◎ Obvious cost advantage ◎ Low resistance,Good conductivity ◎ High reliability,Good corrosion resistance ◎ Stable bonding workability

Copper Bonding Wire

◎ Smaller wire diameter ◎ Obvious cost advantage ◎ Suitable for micro-pitch welding ◎ IMC Slow growth, higher reliability ◎ Good electrical and thermal conductivity

Au/Pd Copper Bonding Wire

◎ Good oxidation resistance ◎ The second solder joint has excellent performance ◎ Pd well-coated,high reliability ◎ The atmosphere protection is not sensitive ◎ Line arc stabilization ◎ The bonding window is extensive

Au Silver Bonding Wire

◎ No gas protection in the bonding process ◎ Better Mechanical Properties than good wire ◎ IMC grow slowly ◎ Good bonding workability

Large diameter copper Bonding Wire

◎ Super soft copper wire ◎ Excellent electrical conductivity ◎ Lowest electrical resistance ◎ Good ductility and easy bonding

Aluminium Bonding Wire/Aluminium Bonding Ribbons

◎ High reliability ◎ Single intermetallic bonding,No IMC problems ◎ Good thermal stability ◎ Good corrosion resistance ◎ Low cost

Evaporating Materials/Sputtering Targets

Based on professional purification and smelting processing technology, to meet the needs of different customers of high purity materials and alloys of different shapes. It is widely used in the field of microelectronics and display.
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