Characterization of Internet Interface Reaction

Aiming at the interconnection interface reactions in the microelectronic manufacturing process such as brazing reflow and wire bonding, the laws of atomic diffusion and migration, material composition changes, and intermetallic compound growth and transformation are clarified through micro nano scale fine structure characterization, which provides a reliable theoretical basis for optimizing process design and performance improvement.

Service Items

Component analysis

Phase identification

Observation of sectional organization

Grain size and orientation

Production orientation relation

IMC nucleation and growth, etc

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