Research and development of new interconnect materials

By utilizing technologies such as smelting, chemical plating, and electroplating, new lead-free solder materials, UBM interface and reaction materials, TVS through-hole filling materials, thermal interface heat dissipation materials, metal bonding wires, and other new interconnect materials are prepared and developed. Organizational and performance analysis tests related to practical applications are conducted to meet the new requirements for material properties in the development of microelectronics.

Service Items

Solder ball / Bump

Electroplating/Chemical Plating Thin Film Materials

Through-hole filling material

Thermal interface material

Bonding thread, etc

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