Construction of semiconductor material production university research complex

Based on the scientific research and production foundation of Yantai YesDo Electronic Materials Co., Ltd. and Yantai YesDo Microelectronics Industry Research Institute, especially the semiconductor packaging material testing platform, we have obtained the support of Yantai Jinuo Semiconductor Fund and the government, and cooperated with university research institutes such as Harbin Institute of Technology, AVIC, Beijing University of Science and Technology, and the Microelectronics Interconnection Materials Research and Development Laboratory of the Chinese Academy of Sciences, as well as testing institutions such as MCC Testing and Lyon, including local semiconductor material production and research enterprises such as Xianhua, Debang, Hilde, supporting equipment, tools and materials manufacturers such as Meck, Chengyixin, Luxin, and other packaging and testing enterprises such as Ruichuang, Taixin, and strengthened cooperation with international companies such as Henkel Loctite, Hollysch, Xile, etc. Contact and exchange of the company, build semiconductor material R&D and testing platform, pilot production base, semiconductor material R&D and innovation center, equipment and tool R&D and innovation center The intelligent manufacturing innovation and service center and postdoctoral workstation carry out research on the basic mechanism of products and manufacturing technology, carry out innovation and tackle key problems, solve bottlenecks and common problems in the development of the industry, improve the independent research and development capability of enterprises, and eventually build a Chinese semiconductor materials research and manufacturing center, driving the healthy development of the entire industry.

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