In the crisp autumn air of November, Harbin Engineering University Yantai Graduate School hosted a special academic event. As a leading figure in the semiconductor bonding wire industry, Chairman Lin Liang's visit not only delivered an engaging lecture but also provided our faculty and students with a unique opportunity to gain firsthand insights into the cutting-edge developments within the semiconductor sector.

Beyond delivering professional lectures, Chairman Lin also shared his personal growth journey and career planning advice with the students. He emphasized that as graduate students, they should cultivate a global perspective and innovative mindset, continuously improve themselves, and embrace challenges. His words and actions inspired every student present to dedicate themselves to future research and work with renewed enthusiasm.

Returning from Overseas Studies with Resolute Conviction, Devoting Himself to the Path of Serving the Nation Through Science and Technology

In the 1990s, as a member of the national “Project 908” for integrated circuits during the Eighth Five-Year Plan period, Mr. Lin Liang was sent to Germany for advanced studies to learn key materials and bonding wire technology equipment for integrated circuits. This experience proved not only an accumulation of knowledge but also a profound spiritual awakening. He deeply realized that despite the favorable working environment and living conditions abroad, as a Chinese citizen, his heart remained deeply attached to his motherland's development and national rejuvenation. It was this conviction and passion that led him to resolutely return to China after completing his studies, where he participated in establishing the nation's first modern bonding wire production line.

Facing Challenges Head-On, Driving Development Through Innovation

Upon his return, Mr. Lin Liang confronted immense challenges: tight funding, high technical barriers, and difficult market expansion. Yet these obstacles did not deter him. Instead, they ignited his fighting spirit. Mr. Lin Liang led his team in overcoming one technical hurdle after another, achieving a series of significant R&D breakthroughs. They successfully developed key bonding wire equipment for melting, wire drawing, annealing, and winding, and shared these innovations openly with domestic peers. This not only broke foreign monopolies on core equipment technology but also enabled domestic self-sufficiency in supporting equipment, injecting powerful momentum into the overall development of China's semiconductor bonding wire industry.

Advancing Industry Technology and Fostering Inter-Enterprise Collaboration

Mr. Lin Liang deeply understood that a company's long-term growth relies on the support and guidance of its corporate culture. He consistently emphasized the corporate mission of “providing leading eco-friendly packaging materials for the microelectronics industry” and championed a spirit of proactive advancement and bold innovation among employees. This corporate culture fostered and strengthened the team cohesion at Yinuo Electronics, providing a continuous source of momentum for the company's development. Simultaneously, Mr. Lin actively promotes technical collaboration and knowledge sharing among industry peers. He believes such cooperation integrates R&D resources and capabilities, enabling joint resolution of technical challenges, accelerating the development and application of new technologies, and driving overall industry advancement.

Looking Ahead: Building a Brighter Future Together

Moving forward, Yinuo Electronics will steadfastly uphold its quality philosophy of “delivering products that meet customer expectations and providing premium service while continuously innovating and improving.” The company will intensify its commitment to technological innovation, relentlessly enhancing product quality and technical standards. Concurrently, Yinuo will actively explore new application domains and market opportunities, engaging in deeper collaboration and exchange with domestic and international peers through an open approach. Together, we will propel the prosperous development of the semiconductor bonding wire industry.

Yantai YesDo Electronic Materials Co., Ltd

Tel: 0086-535-6371516 

Tel: 0086-535-6379128

E-mail: yesdo@163.com

Add: No. 36, Macao Road, Development Zone, Yantai City, Shandong Province, China