Congratulations to Yinuo Electronics on the successful evaluation of its scientific and technological achievements!-YesDo Electronic Materials -- Focusing on the wire bonding industry

Focusing on the wire bonding industry

Congratulations to Yinuo Electronics on the successful evaluation of its scientific and technological achievements!

2020-12-22

On October 21, 2020, the China Nonferrous Metals Industry Association completed its evaluation of the scientific achievement submitted by Yinuo Electronics—Research and Application of High-Reliability Silver and Silver Alloy Bonding Wires for Semiconductor Packaging—and awarded it the title of Scientific Achievement.

Yinuo Electronics' bonding wire technology leads the industry, possessing proprietary core technologies in the formulation of multi-element alloys (gold, silver, copper, aluminum) and casting processes. Its bonding silver wires and copper alloy wires represent globally pioneering products, and the company spearheaded the development of China's national industry standard for semiconductor bonding silver wires. Currently, Yinuo Electronics holds five national invention patents, including bonding silver wire and its preparation method, silver alloy wire and its preparation method, flexible bonding copper wire and its preparation method, copper-silver alloy bonding wire and its preparation method, and insulated coated corrosion-resistant alloy bonding wire and its preparation method, along with 14 utility model patents.

Congratulations! Yantai Yinuo Electronics has successfully passed the 2021 Shandong Province Gazelle Enterprise re-evaluation!

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