YesDo Electronic Materials -- Focusing on the wire bonding industry

Focusing on the wire bonding industry

+86-535-6371516

yesdo@163.com

YesDo Electronic Materials

Professional service provider of bonding wire

Learn More →

YesDo Electronic Materials

Professional service provider of bonding wire

Learn More →

YesDo Electronic Materials

Professional service provider of bonding wire

Learn More →

YesDo Electronic Materials

Professional service provider of bonding wire

Learn More →

scroll down

About Us

Yantai YesDo Electronic Materials Co., Ltd., established in September 2007 and situated within the Yantai Economic and Technological Development Zone in Shandong Province, is a high-tech enterprise specialising in the research, development, production, and sales of bonding wires and welding materials. Its product portfolio encompasses silver-based bonding wires, gold bonding wires, copper bonding wires, aluminium wires, chip welding wires, as well as evaporation and sputtering materials. These products serve multiple sectors including electronic packaging and semiconductor chip fabrication.

Learn More →

2007 Year

Company Established

25 Million

Registered capital

10 +

Application Areas

20 Ton

Sales Market

PRODUCT DISPLAY

Gold Bonding Wire

◎ Manufactured from high-purity materials(99.999%) ◎ Unique alloy doping ◎ Excellent wire stability ◎ Excellent bonding workability

Silver Bonding Wire

◎ Manufactured from high-purity materials ◎ Unique alloy doping ◎ Obvious cost advantage ◎ Low resistance,Good conductivity ◎ High reliability,Good corrosion resistance ◎ Stable bonding workability

Copper Bonding Wire

◎ Smaller wire diameter ◎ Obvious cost advantage ◎ Suitable for micro-pitch welding ◎ IMC Slow growth, higher reliability ◎ Good electrical and thermal conductivity

Au/Pd Copper Bonding Wire

◎ Good oxidation resistance ◎ The second solder joint has excellent performance ◎ Pd well-coated，high reliability ◎ The atmosphere protection is not sensitive ◎ Line arc stabilization ◎ The bonding window is extensive

Au Silver Bonding Wire

◎ No gas protection in the bonding process ◎ Better Mechanical Properties than good wire ◎ IMC grow slowly ◎ Good bonding workability

Large diameter copper Bonding Wire

◎ Super soft copper wire ◎ Excellent electrical conductivity ◎ Lowest electrical resistance ◎ Good ductility and easy bonding

Aluminium Bonding Wire/Aluminium Bonding Ribbons

◎ High reliability ◎ Single intermetallic bonding，No IMC problems ◎ Good thermal stability ◎ Good corrosion resistance ◎ Low cost

Evaporating Materials/Sputtering Targets

Based on professional purification and smelting processing technology, to meet the needs of different customers of high purity materials and alloys of different shapes. It is widely used in the field of microelectronics and display.

All Products →

Online Message→

TESTING AND SEALING PLATFORM

The platform has assembled a professional team of scientific researchers, technical experts, R&D and engineering technicians in the field of packaging materials and packaging technology. It has undertaken and participated in more than ten national, provincial, ministerial and municipal scientific research projects, applied for more than ten invention patents in the field of packaging materials and packaging testing technology, and established close cooperative relationships with more than 20 domestic and foreign enterprises and research institutions. It has accumulated rich experience in technical consultation, microscopic characterization, failure analysis, reliability testing, process breakthrough and other aspects.